硫酸铜填孔电镀理论-anicadditivespeciesBrightener/acceleratorCarrier/elerator电镀反应:(摘要)可溶解性阳极Function1ReducetheactivationenergyandincreaseCudepositionrateAdditivecanbemonitoredbyCVSusingstandardadditionmethodorHullCellAdditiveChemistryFunction2ThesidechainsontheadditivemoleculehasabarrierforCu+(Cont.)(Cont.)positionofadditiveonCusurface,suchasanode2S(-1)+2e-2S(-2)CuCu2++2e-OccurredmainlyduringbathidlingAirbubblingduringidlingcanusuallysolvetheby-productformationissueControlofadditivecontentBy-productspeedsuptheCudepositionatleast20timesAbathdominatedbytheby-productgivescolumnarmicrostructureControlofAdditivecontent(Cont.)Additive浓度对电镀效率的影响硫酸铜填孔电镀:,扩散反应(主导填孔),,
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